![[Test Reception Open] Automatic Solder Ball Mounting Line](https://image.mono.ipros.com/public/product/image/394/2001489711/IPROS58276800525874369337.png?w=280&h=280)
[Test Reception Open] Automatic Solder Ball Mounting Line
【Exhibition Participation】Recommended for the semiconductor backend, organic packaging, and assembly industries! Automatically and evenly attaches solder balls.
The "Solder Bouncer Line" is an automatic ball mounting line for flip chip solder bumps, which eliminates the need for a mask during ball mounting thanks to our patented technology that utilizes vibration. Image inspection tailored to the purpose is installed inline. Our unique vibration transfer technology allows for testing with various shapes and sizes. We are currently accepting tests with great enthusiasm. 【Features】 ■ Can evenly attach solder balls to flux ■ Enables maskless solder ball mounting ■ Easy to switch between varieties and user-friendly ■ Contributes to improved yield Additionally, we will be exhibiting at "SEMICON JAPAN 2024" held at Tokyo Big Sight (Hall 2, Booth 2655). We sincerely look forward to your visit. *For more details, please download the PDF or feel free to contact us.
- 企業：マイクロ・テック
- 価格：Other
